High temperature high pressure tag

ABSTRACT

A tag, such as an RFID tag, and system including an RFID tag configured for installation into an object are provided. The tag is configured for use in high temperature and/or high pressure environments such as downhole and subsea applications. The tag includes an electronics module contained within a bead, which is housed in a cavity of a carrier. The bead is surrounded by a protective fluid-like fill material to provide protection to the electronics module and bead and provide fluid-like properties to the electronics module to reduce or eliminate point stresses on the electronics module. The geometry of the tag is such that the entire outline of the tag is contained within the geometry of the object to provide structural protection of the tag.

BACKGROUND

1. Field of Invention

Embodiments of the invention relate generally to identification tags,and more specifically, to Radio-frequency identification (RFID) tagsconfigured for usage in high temperature and/or high pressureenvironments.

2. Description of Related Art

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present invention,which are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentinvention. Accordingly, it should be understood that these statementsare to be read in this light and not as admissions of prior art.

Identification tags, such as RFID tags are often used to manage andtrack objects, such as system components, tools, machinery, equipment,etc., through production, inventory, storage, deployment and/or productuse. In general, RFID tags include a microchip or integrated circuitused to transmit and/or store identification information and possiblyother information. An external transceiver/interrogator/reader locatedremotely with respect to the RFID tag is used to receive informationfrom and/or transmit information to the RFID tag. The RFID tag typicallyincludes an antenna that transmits RF signals relating to theidentification and/or information stored within the RFID tag.

For certain applications, such as surface and downhole oil and gasapplications, RFID tags may be utilized to track equipment andinventory. However, to be particularly useful, the RFID tags should bedesigned such that equipment can be tracked while in storage, transit,and field use, (i.e., surface, downhole and underwater), depending onthe type of equipment and the utilization thereof. Further, for downholeor underwater applications, the durability of such RFID tags presents anumber of additional challenges. Among the various considerations arestructural integrity through a wide range of temperatures and pressures,as well as mechanical forces, readability of the RFID tag and ease ofinstallation, for instance.

It may be desirable to design an optimized RFID tag for trackingcomponents utilized in surface and downhole applications.

BRIEF DESCRIPTION OF DRAWINGS

Certain embodiments are described in the following detailed descriptionand in reference to the drawings in which:

FIG. 1A illustrates a schematic view of an RFID tag system including amounted RFID tag, in accordance with embodiments of the invention;

FIG. 1B illustrates an enlarged view of the RFID tag of FIG. 1A, mountedwithin a material, in accordance with embodiments of the invention;

FIG. 1C illustrates a partial cross-sectional schematic view of the RFIDtag pocket configured to receive the RFID tag of FIGS. 1A and 1B, inaccordance with embodiments of the invention;

FIGS. 2-4 illustrate schematic views of the RFID tag, in accordance withfirst embodiments of the invention;

FIG. 5 illustrates a schematic view of the RFID tag, in accordance witha second embodiment of the invention;

FIG. 6 illustrates a schematic view of the RFID tag, in accordance witha third embodiment of the invention;

FIG. 7 illustrates a schematic view of the RFID tag, in accordance witha fourth embodiment of the invention;

FIGS. 8 and 9 illustrate embodiments of caps employed in the embodimentof FIG. 7; and

FIGS. 10A-10D illustrate schematic views of the RFID tag, in accordancewith fifth embodiments of the invention.

DETAILED DESCRIPTION

One or more specific embodiments of the present disclosure will bedescribed below. In an effort to provide a concise description of theseembodiments, not all features of an actual implementation are describedin the specification. It should be appreciated that in the developmentof any such actual implementation, as in any engineering or designproject, numerous implementation-specific decisions must be made toachieve the developers' specific goals, such as compliance withsystem-related and business-related constraints, which may vary from oneimplementation to another. Moreover, it should be appreciated that sucha development effort might be complex and time consuming, but wouldnevertheless be a routine undertaking of design, fabrication, andmanufacture for those of ordinary skill having the benefit of thisdisclosure.

Generally, embodiments of the invention are directed to anidentification system including an identification tag, such as an RFIDtag, configured for installation into an object. In certain embodiments,the object may include a structure such as a pipe, riser, flange,weldment, casting, or any material or tool used in rugged environments,where high pressures and temperatures may be encountered. In accordancewith embodiments of the present invention, the RFID tag is designed foruse in high temperature and/or high pressure environments. Depending onthe application and the materials used to fabricate the RFID tag, theRFID tag may be particularly well suited for downhole and subseadrilling, mining or industrial equipment. As will be described infurther detail below, the disclosed RFID tag is optimized for usage inhigh temperature and/or high pressure environments and mayadvantageously provide readability, easy installation, and packagingthat is resistant to mechanical and chemical stresses, even in harshconditions. As discussed further below, the disclosed RFID tag may bedesigned to survive at sustained (i.e., for at least 1000 hours)temperatures greater than or equal to 165° C. and as low as temperaturesof liquid nitrogen. Further, the RFID tag is designed to survive atpressures of up to 40,000 PSI, without significant degradation infunctionality. Further, the RFID tag may survive at pressures greaterthan 40,000 PSI.

Turning now to the drawings, and referring initially to FIG. 1A, an RFIDtag system 10 is illustrated. Specifically, the RFID tag system 10includes an RFID tag 12 and a reader 14. The reader 14 is generallyconfigured to interrogate the RFID tag 12. Accordingly, the reader 14typically includes a transmitter and receiver for exchanging RFIDinformation with the RFID tag 12. The reader 14 may also include aprocessor for receiving the RF data from the RFID tag 12 andextrapolating the RF data into meaningful data whereby identification orother stored information can be perceived by a user. In certainembodiments, the reader may be integrated with a computer system.

As will be appreciated, while an RFID tag system 10, including an RFIDtag 12 is illustrated and described below, embodiments of the inventionmay utilize other types of identification tags, which utilize othertypes of wireless technology, such as Sonic Acoustic Wave (SAW), ultralow frequency, high frequency or ultra high frequency, or systems orcombinations of frequency that are used for powering, interrogating orreading, writing or accessing information or identities stored within anelectronics module contained in a manner expressed herein. That is,while the exemplary embodiments describe using RF technology to provideidentification of the tagged components, the packaging configurationsdescribed below may also be used to encase other types of identificationand data storage modules. Still further, while identification modulesare described, one skilled in the art would appreciate that anyelectronics module or sensor that may be desired for a particularapplication, may be packaged as described, such that the electronicsmodule may be utilized in a high pressure and/or high temperatureenvironment.

As will be discussed and illustrated further below with regard to FIGS.2-10D, each of the embodiments of the RFID tag 12 include a carrier,having an electronics module suitably packaged therein. The electronicsmodule has the ability to store an identifier and an associatedintegrated circuit as applicable for storing and processing informationand manipulating RF signals. The electronics module further includes anantenna for transmitting and receiving RF signals. The RFID tag 12 maybe passive, active, or semi-active. Passive RFID tags rely on the readerto provide the power source for activation. While passive RFID tags 12may be employed for certain applications, active or semi-active RFIDtags 12 may be more suitable for applications where the reader 14 islocated beyond the range of the RFID tags 12 ability to passivelycommunicate with a reader. If the RFID tag 12 is active or semi-active,the RFID tag 12 may include a battery for transmission of RF signals.

In the embodiment illustrated in FIG. 1A, the RFID tag 12 is installedinto the surface of a pipe 16. For instance, the pipe 16 may be part ofmachinery that may be used in a downhole or subsea drilling operation.While the RFID tag 12 illustrated in FIG. 1A is installed into thesurface of a pipe 16, the RFID tag 12 in accordance with embodiments ofthe invention is designed to be installed into the surface of othermaterials, tools or equipment, such as weldments, castings, or anyobject or material having a thickness large enough to receive the RFIDtag 12 within the object or material. Advantageously, by embedding theRFID tag 12 into the surface of a material, the material itself providesthe RFID tag 12 with surrounding protection from physical stresses andreduces the potential for the RFID tag 12 to be dislodged from the toolby mechanical forces. That is, because the RFID tag 12 is entirelyrecessed into the surface of the material, and thus contained entirelywithin the geometry of the material (e.g., pipe 16), the materialprovides protection of the RFID tag 12 from impacts, abrasion and otherdeleterious effects or events which could destroy or dislodge a surfacemounted tag.

FIG. 1B illustrates an enlarged view of the RFID tag 12 of FIG. 1A. Asillustrated, the RFID tag 12 is installed within a pre-formed tag pocket18. The tag pocket 18 may be formed in the surface of the pipe 16 by adrilling process. Advantageously, the tag pocket 18 may be formed by asingle drill and may be formed in existing equipment or tools, toretrofit the equipment or tools with an identification and trackingmechanism (i.e., the RFID tag 12). As illustrated in FIG. 1B, the tagpocket 18 is sized to receive the RFID tag 12, such that the RFID tag 12is embedded completely within the pipe 16. That is, the depth of the tagpocket 18 is greater than or equal to the thickness of the RFID tag 12.In the illustrated embodiment, the RFID tag 12, and corresponding tagpocket 18, may including threading 20 such that the RFID tag 12 may berotatably engaged within the pipe 16. In certain embodiments, the RFIDtag 12 is secured into the tag pocket 18 by purely mechanical andfrictional forces, such as by rotating the RFID tag 12, such that thethreading 20 of the RFID tag 12 mateably engages like-threading in thetag pocket 18. Alternatively, an adhesive, epoxy or glue (not shown)suitable for the intended field application, may be used in conjunctionwith, or alternatively, instead of, the threading 20, to mechanicallycouple the RFID tag 12 to the pipe 16. In one embodiment, the density ofthe threading 20 may be 20 threads/inch or coarser. For instance, thedensity of the threading 20 may be 16 threads/inch.

Referring now to FIG. 1C, aspects of the tag pocket 18 are described.Specifically, FIG. 1C illustrates a cross sectional view of the tagpocket 18. In one implementation, the tag pocket 18 is drilled into thesurface of the pipe 16. As will be appreciated, such a pocket 18 may bedrilled in the surface of any material or tool having a thicknessgreater than the pocket depth PD necessary to completely contain theRFID tag 12. The material in which the tag pocket 18 is formed istypically a hard material, such as steel, and may be any tool, equipmentor object, for which RFID tracking is desired. As will be understood, inthe illustrated embodiment, the tag pocket 18 is sized and shaped suchthat the RFID tag 12 can be disposed therein, in a mated relationshipand secured by the threading 20. The tag pocket 18 may be formed in thepipe 16 using a drill with an appropriately sized drill bit.

Correspondent to the RFID tag 12 described with reference to FIGS. 2 and3, the illustrated embodiment of the tag pocket 18 has a thread depth TDwhich indicates the thickness (depth) of the threaded portion of theRFID tag 12. The thread relief diameter TRD indicates the diameter ofthe widest portion of the threading 20. As also indicated in FIG. 1C,the illustrated pipe 16 has an outer dimension OD (here acircumference). A wear limit diameter WLD is also illustrated to providea sufficient distance (here a circumference) from the edge of the pipe16, such that the RFID tag 12 may be completely embedded within the pipe16. The wear limit diameter WLD indicates the minimum diameter of theRFID tag 12. If the surface of the material in which that tag pocket 18were being drilled was flat, the WLD and OD would be equal and thepocket depth PD would be equal to the thickness of the RFID tag 12.However, because the surface of the pipe 16 is curved, the pocket depthPD may be adjusted in accordance with the diameter of the pipe, suchthat a certain depth is added to the WLD to ensure that the RFID tag 12may be completely embedded with the pipe 16.

As will be appreciated, the illustrated threading 20 may be provided fora screw fitting and used in conjunction with or instead of an epoxywhich may also be deposited within the tag pocket 18 to secure the RFIDtag 12 therein. In certain embodiments, wherein the surface of the tagpocket 18 includes threading 20, the RFID tag 12 may have similarthreading 20 to mate with the surface within the tag pocket 18. In thiscase, the RFID tag 12 may be rotated or screwed into the tag pocket 18.In embodiments where the threading 20 is not included, the RFID tag 12may be inserted into the pre-formed tag pocket 18, after an epoxy hasbeen dispensed within the tag pocket 18, to partially fill the tagpocket 18. The RFID tag 12 is then pressed into the epoxy to eliminateany voids in the tag pocket 18. The tag pocket 18 may be ridged orabrasive to add frictional forces to the epoxy disposed in the tagpocket 18 if threading 20 is not employed.

Referring now to FIGS. 2 and 3, two views of one embodiment of the RFIDtag 12 are illustrated. In one embodiment, the diameter D of the RFIDtag 12 may be in the range of approximately 0.50 to 1.5 inches, and havea thickness T in the range of approximately 0.20 to 0.50 inches. TheRFID tag 12 includes a bead 24 and a carrier 26, configured to house andcontain the bead 24. In one embodiment, the bead 24 may be a glass.Advantageously, glass is both chemically inert and may be resistant tomechanical pressures up to, and possibly exceeding, 40,000 PSI, when thepressures are evenly distributed. The bead 24 includes an electronicsmodule 28, contained therein.

Referring briefly to FIG. 4, one embodiment of the electronics module28, contained within the bead 24 is illustrated. Specifically, theelectronics module 28 may be a low frequency RFID electronics module 28within the impermeable spherically ended cylinder or bead 24 made ofhigh purity industrial glass. For some applications, an optimalfrequency for the RFID electronics module 28 is 125 KHz-135 KHz, but inother applications a different frequency range may be preferred. In someapplications, ultra low frequency, high frequency, ultra high frequencyor frequency combination RFID electronics module 28 can be used.

Referring still to FIG. 4, in one embodiment, the electronics module 28contains a dipole including a ferrite core 30 and an antenna 32, whichis wrapped around the ferrite core 30. The antenna 32 may be bonded tothe integrated circuit 34, which includes the identification informationstored thereon for reading the RFID tag 12. In one embodiment, theintegrated circuit includes a bipolar integrated circuit. RF AcousticWave devices may be employed in a similar manner where highertemperatures and/or pressures are experienced during usage. Theelectronics module 28 includes wire bondings that are appropriate forthe sustained high and low temperatures and carries an identifier insuch a manner that the identity of the RFID tag 12 will not be lostduring sustained high temperature exposure. The use of a dipole RFID tag12 may provide desirable performance when installed within a radioopaque material, such as a steel material. The design enables longerread distances with any RF based system, especially low frequency RFsystems.

In one embodiment, the electronics module 28 is packed in the glass bead24 within a silicone gel material 36, or other incompressible liquid, toprovide consistent fluid-like pressure to the electronics module 28.Advantageously, the silicone gel material 36 absorbs vibration andavoids crystallization at sustained high temperatures. Potting andfiller materials may also be used to package the electronics module 28within the bead 24. In one embodiment, the electronics module 28includes packing materials which allow operation of the RFID tag 12 atsustained temperatures over 165° C., and in another embodiment, over180° C. The electronics module 28 is designed such that it will continueto perform well in high magnetic fields and such that it will not bedestroyed by rapid and strong magnetic fluctuations to which it may beexposed.

Referring again to FIGS. 2 and 3, in one embodiment, the carrier 26 isgenerally circular or disk-shaped. In one embodiment, the carrier 26 maybe formed using a high performance thermoplastic, such asPolyEtherEtherKetone (PEEK). Advantageously, PEEK thermoplastic ishighly resistant to chemicals, has high strength, absorbs impacts well,has a high melting point and maintains a low brittleness at very lowtemperature. Pigment can be added to the plastic for UV resistance asdesired. Alternatively, other radio transparent materials can be usedinstead of PEEK thermoplastic, depending on the environmental andoperational characteristics of the application. For example,Acrylonitrile Butadiene Styrene (ABS) or other molded plastic could beused under some environmental and operational conditions. A disk ofceramic or other highly inert and abrasion resistant material may beadded to the surface of the carrier 26 to increase abrasion resistancebeyond the PEEK capabilities. Similarly, the entire material containingthe carrier 26 may be formed of a ceramic or alternate material with theappropriate properties for the described environmental conditions.

The carrier 26 may also include holes or openings 38 which providepressure equalization across the RFID tag 12. Further, the openings 38may aid in the mounting of the RFID tag 12 into a material or tool(e.g., pipe 16). The openings 38 in the carrier 26 also allow for easyhandling of the RFID tag 12 using a tool. For instance, the openings 38provide recesses in which a tool can be inserted to rotatably couple theRFID tag 12 into the material or tool (e.g., pipe 16). In oneembodiment, the openings 38 may extend through the entire thickness ofthe RFID tag 12.

As described, the electronics module 24 is packaged within animpermeable material (e.g., silicone gel 36, surround by glass) which isin turn packaged within the carrier material (e.g., PEEK), which is thenmounted within the object or material (e.g., pipe 16) mechanically or byadhesive. While the design of the bead 24, and particularly, theselection of a glass material having a silicone gel material 36 used tosurround the electronics module 28, provides the electronics module 28with sufficient protection at high temperatures and high pressures, thepackaging of the bead 24 within the carrier 26 also presents a number ofdesign challenges. In one embodiment, the bead 24 is inserted into acavity 40 in the carrier 26 that minimizes stress on the glass bead 24which contains the electronics module 28 (FIG. 4). The cavity 40 isformed in a direction parallel to the planar surface of the RFID tag 12,as shown.

As previously described in certain applications, especially downhole andsubsea applications and other high temperature and high pressureenvironmental applications, the packaging of the bead 24 that holds theelectronic module 28 should be robust in order to withstand such harshenvironments. If the bead 24 were merely encapsulated within the carrier26, such that the carrier material 26 contacts the bead 24, directly,the bead 24 may be damaged by deformation of the carrier material 26 athigh temperatures or pressures, or combinations of both. In accordancewith embodiments of the present invention, in order to protect the glassbead 24 within the carrier 26, the glass bead 24 is completelysurrounded by a protective fluid-like fill material 42 disposed in thecavity 40 of the carrier 26, as illustrated in FIGS. 2 and 3. As usedherein, a “protective fluid-like fill material” refers to a materialthat provides a uniform pressure to an object surrounded by thematerial, here the bead 24, over a temperature range of −65 ° C. to atleast 210 ° C. and at pressures up to at least 40,000 PSI. Ideally, theprotective fluid-like fill material 42 should be both physically inertand chemically inert to prevent degradation of the electronics module 28with the bead 24. As used herein, the term “chemically inert” refers toa material that will not react with chemicals expected to be encounteredfor a given application (e.g., downhole or subsea applications),including chemicals in different phases or states. The term “physicallyinert” refers to materials that withstand temperatures and pressures andwill not significantly expand or contract or produce vapors attemperatures or pressures expected for the given application.

Not only should the protective fluid-like fill material 42 be chemicallyand physically inert, but it should be chosen such that crystalformation, such as ice formation, is mitigated, as crystal formation inthe cavity 40 could potentially damage the bead 24. As will beappreciated, if crystals form within the cavity 40, the bead 24 is morelikely to be damaged.

In one embodiment, the protective fluid-like fill material 42 maycomprise a gel such as a silicone gel. The silicone gel may be asilicone room-temperature vulcanizing (RTV) gel. For instance, siliconeproducts SS-4060, SS-5060, SS-6060, and SS-6080 are suitable roomtemperature curing silicone RTV gels available from Silicone Solutions™.These gels, as well as other gels, are generally two-part, 1:1 mix ratiosilicone materials that cure at room temperature within 180 minutes. Aswill be appreciated, while these gels may cure at room temperature,faster cure temperatures may be achieved using heat. Once cured, thesilicone gel is highly resistant to ozone moisture and temperaturedegradation. In one embodiment, the protective fluid-like fill material42, (e.g., one of the aforementioned silicone gels), may maintain itsrobust properties through temperatures ranging from −65° C. to 250° C.Further, the protective fluid-like fill material 42 provides aprotective area for the glass bead 24 up to 40,000 PSI in fluid. In analternative embodiment, the protective fluid-like fill material 42 maybe halocarbon oil, which may provide similar qualities.

In one embodiment, during assembly of the RFID tag 12, the cavity 40 maybe partially filled with the protective fluid-like fill material 42.Once the cavity 40 is partially filled, the glass bead 24 may bepositioned within the cavity 40 such that it is surrounded completely atone end by the protective fluid-like fill material 42. Once the bead 24is positioned, the remainder of the cavity 40 may be filled with theprotective fluid-like fill material 42 such that the cavity 40 iscompletely filled and such that the glass bead 24 is completelysurrounded by the protective fluid-like fill material 42, creating acomplete barrier between the surface of the bead 24 and the walls of thecarrier 26, within the cavity 40.

Advantageously the protective fluid-like fill material 42 is a softmaterial that provides even, compressive forces. As will be appreciated,the glass bead 24 is strong under consistent pressure in fluid but maybe weak under bending or non-consistent pressures. The protectivefluid-like fill material 42 is so soft such that it essentially acts asa fluid to apply consistent fluid forces to the glass bead 24 containingthe electronics module 28. This isolates the glass bead 24 from physicalbending and point pressure forces while also providing advantageousvibration dampening. Further, any microscopic bubbles entrapped in thesoft gel (i.e., protective fluid-like fill material 42) are collapsedunder pressure rather than creating a failure path as they would in asolid material, such as epoxy. Accordingly, the protective fluid-likefill material 42 provides additional durability for the RFID tag 12.

While the silicone gel or halocarbon oil may provide sufficientprotection for many applications, especially from mechanical forces asdiscussed above, in certain embodiments, it may be advantageous to alsoprovide a membrane at the top of the cavity 40 to provide additionalprotection against chemical reaction of the underlying protectivefluid-like fill material 42. Referring now to FIG. 5, an alternativeembodiment including a membrane material 44 is illustrated. Asillustrated in FIG. 5, rather than completely filling the cavity 40 withthe protective fluid-like fill material 42, the cavity 40 is filled withprotective fluid-like fill material 42 such that the fill material 42completely surrounds the bead 24 but where a portion at the top of thecavity 40 is left unfilled. The remainder of the cavity 40 may then befilled with a membrane material 44. The membrane material 44 may provideadditional protection of the underlying protective fluid-like fillmaterial 42 from chemical reaction. In one embodiment, the membranematerial 44 may be fast cure gasoline resistant silicone RTV adhesivesealant, such as SS-300, available from Silicone Solutions™. SS-300 is a1-part silicone that cures within one hour. As will be appreciated, themembrane material 44 may be chosen to provide additional protection ofthe underlying protective fluid-like fill material 42 when chemicalingress and deterioration of the chosen protective fluid-like fillmaterial 42 are of concern. Further, the membrane material 44 may bespecifically chosen such that it is resistant to the chemicals andenvironmental affects which may be expected to be encountered in theparticular application in which the RFID tag 12 is to be use.

Referring now to FIG. 6, another embodiment of the RFID tag 12 isillustrated. In the embodiment illustrated in FIG. 6, the cavity 40 iscapped or over-filled with an over-fill material 46. In one embodiment,the over-fill material 46 may be the same material as the underlyingprotective fluid-like fill material 42. In certain applications, theover-fill material 46 may be sheared flush with the outside of thecarrier 26. In one embodiment, the over-fill material 46 may comprise asilicone RTV material.

Referring now to FIG. 7, yet another embodiment of the RFID tag 12 isillustrated. As with the embodiment described with reference to FIG. 5above, in the present embodiment, the protective fluid-like fillmaterial 42 is disposed within the cavity 40 such that it completelysurrounds the bead 24, but such that a portion at the top of the cavity40 is left unfilled. In this embodiment, a cap 48 may be pressed intothe top of the cavity 40. As with the membrane material 44, the hard cap48 provides additional protection of the underlying protectivefluid-like fill material 42, especially from chemicals. As will beappreciated, the cap 48 is sized to be frictionally secured within thecavity 40. In one embodiment, the cap 48 may comprise fluorosilicone,perfluoroelastomer (FFKM), Aflas™ or such as polytetrafluoroethylene(PTFE), also known as Teflon™. Providing the cap 48 comprising a solidmaterial introduces a chemically inert barrier to the protectivefluid-like underlying fill material 42. FIGS. 8 and 9 illustrate twoembodiments of caps 48 that may be employed. Each cap 48 includes one ormore recessed regions 50 which provide relief such that the cap 48 maybe deformed somewhat in high pressure environments in a manner that willincrease the sealing function of the cap 48 against the walls of thecavity 40 in the carrier 26. The number of cavities 50 may depend on thethickness of the cap 48 such that the cap 48 may be readily deformed orflexed downward about the cavities 50 to evenly transmit pressure to theprotective fluid-like fill material 42.

FIGS. 10A-10D illustrate another embodiment of the RFID tag 12. Asillustrated, the carrier 26 may be fabricated with a segment cavity 54,as best shown in FIG. 10B. An independent carrier segment 52 may befabricated separately. The carrier segment 52 includes a cavity 40, aspreviously described and illustrated, wherein the glass bead 24 iscompletely surrounded by a protective fluid-like fill material 42. Thecarrier segment 52 may be inserted into the segment cavity 54 of thecarrier 26. The carrier segment 52 may be made of the same material asthe underlying carrier 26. In one embodiment, the sides of the cavity 54and carrier segment 52 may have a smooth, tapered surface. This providesa self-sealing, self-compressing mating system that works with thepressure to improve the reliability of the mating. In anotherembodiment, the sides of the cavity 54 in which the carrier segment 52is deposited may be ridged, as best illustrated in FIG. 10C. The ridges56 may provide a mechanism to mechanically secure the carrier segment 52within the carrier 26. In addition, an adhesive (not shown) may bedisposed within the segment cavity 54 in addition to or instead of theemploying the ridges 56 such that the carrier segment 52 may be securedwithin the carrier 26. As illustrated in FIG. 10D, an additional sealantmaterial 58 may be disposed on top of the carrier segment 52 such thatthe carrier segment 52 is further secured within the segment cavity 54.As will be appreciated, the sealant material 58 may be omitted.

In one embodiment of a fabrication process of the embodimentsillustrated in FIGS. 10A-10D, the carrier segment 52 includes a cavity(not shown). During assembly of the RFID tag 12, the protectivefluid-like fill material 42 is disposed into the cavity. The glass bead24 may then be positioned within the cavity such that it is surroundedcompletely by the protective fluid-like fill material 42, creating acomplete barrier between the surface of the bead 24 and the walls of thecarrier 26, within the cavity. Next, the carrier segment 52 may be heattreated. In one embodiment, the heat treatment may be approximately 1hour at a temperature range of approximately 65° C. to 120° C. Becauseof its expansive properties, while curing the protective fluid-like fillmaterial 42 expands during the heat treatment, such that the cavity isover-filled with the protective fluid-like fill material 42. After thecarrier segment 52 is heat treated, in may be inserted into the cavity54 in the carrier 26. The application of physical force during theinsertion of the carrier segment 52 into the carrier 26 willadvantageously shear the excess protective fluid-like fill material 42,such that it is flush with the tapered edge of the carrier segment 52and such that the entire cavity within the carrier segment 52 iscompletely filled with the protective fluid-like fill material 42,without voids being present within the cavity.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

1. An identification tag, comprising: a carrier comprising a cavitytherein; a bead arranged within the cavity, wherein the bead includes anelectronics module configured to receive and transmit signals; and aprotective fluid-like fill material disposed in the cavity such that itcompletely surrounds the bead.
 2. The identification tag, as set forthin claim 1, wherein the bead comprises a glass bead.
 3. Theidentification tag, as set forth in claim 1, wherein the bead comprisesan impermeable material.
 4. The identification tag, as set forth inclaim 1, wherein the protective fluid-like fill material comprises asilicone gel.
 5. The identification tag, as set forth in claim 1,wherein the protective fluid-like fill material comprises a siliconeroom-temperature vulcanizing (RTV) gel.
 6. The identification tag, asset forth in claim 1, wherein the carrier comprises a thermoplastic. 7.The identification tag, as set forth in claim 6, wherein thethermoplastic comprises a PolyEtherEtherKetone (PEEK).
 8. Theidentification tag, as set forth in claim 1, wherein the electronicsmodule comprises a dipole antenna.
 9. The identification tag, as setforth in claim 1, wherein the electronics module comprises an RFIDmodule configured to operate at a frequency in the range ofapproximately 125 KHz-135 KHz.
 10. The identification tag, as set forthin claim 1, wherein the electronics module comprises an integratedcircuit and an antenna.
 11. The identification tag, as set forth inclaim 1, wherein the identification tag is configured to operate atpressures greater than or equal to 20,000 psi.
 12. The identificationtag, as set forth in claim 1, wherein the identification tag isconfigured to operate at sustained temperatures greater than or equal to165° C.
 13. The identification tag, as set forth in claim 1, comprisinga membrane material disposed in the cavity on top of the protectivefluid-like fill material.
 14. The identification tag, as set forth inclaim 13, wherein the membrane material comprises silicone.
 15. Theidentification tag, as set forth in claim 13, wherein the membranematerial comprises a fast curing silicone room-temperature vulcanizing(RTV) adhesive rubber.
 16. The identification tag, as set forth in claim1, comprising a chemically inert cap disposed in the cavity on top ofthe protective fluid-like fill material.
 17. The identification tag, asset forth in claim 16, wherein the cap comprises a fluorosiliconematerial.
 18. The identification tag, as set forth in claim 16, whereinthe cap comprises a polytetrafluoroethylene (PTFE) material.
 19. Theidentification tag, as set forth in claim 1, further comprising acarrier segment configured to mate with the carrier.
 20. Theidentification tag, as set forth in claim 1, wherein the identificationtag comprises an RFID tag.
 21. A system comprising: a tool having a tagpocket formed in a surface of the tool; an RFID tag secured within thetag pocket such that the RFID tag is embedded within the tool, whereinthe RFID tag comprises a carrier having a protective fluid-like fillmaterial therein and an electronics module contained within theprotective fluid-like fill material.
 22. The system, as set forth inclaim 21, wherein the tool comprises a pipe configured for downhole orsubsea usage.
 23. The system, as set forth in claim 21, wherein theelectronics module is surrounded by a glass bead, and wherein the glassbead is completely surrounded by the protective fluid-like fillmaterial.
 24. The system, as set forth in claim 21, wherein the tagpocket comprises threading and wherein the RFID tag is rotatably coupledinto the tag pocket.
 25. The system, as set forth in claim 21, whereinthe RFID tag is mechanically secured within the tag pocket via anadhesive or epoxy.
 26. The system, as set forth in claim 21, comprisinga carrier segment having the RFID tag surrounded by the protectivefluid-like fill material formed therein, wherein the carrier segment isconfigured to be inserted into a segment cavity of the carrier.
 27. Thesystem, as set forth in claim 21, wherein the RFID tag is completelyembedded within the tool.
 28. The system, as set forth in claim 21,wherein the RFID tag is disk-shaped.
 29. A method of fabricating a tag,comprising: providing a carrier having a cavity therein; at leastpartially filling the cavity with a protective fluid-like fill material;and depositing an electronics module into the protective fluid-like fillmaterial.
 30. The method, as set forth in claim 29, wherein depositingan electronics module comprises depositing a glass bead, having anelectronics module therein, into the protective fluid-like fillmaterial.
 31. The method, as set forth in claim 29, further comprisingdepositing a membrane material into the cavity and on top of theprotective fluid-like fill material.
 32. The method, as set forth inclaim 29, further comprising depositing a cap into the cavity and on topof the protective fluid-like fill material.
 33. The method, as set forthin claim 29, wherein at least partially filling comprises over-fillingthe cavity with the protective fluid-like fill material.
 34. The method,as set forth in claim 29, wherein at least partially filling the cavitycomprises partially filling the cavity with the protective fluid-likefill material before depositing the electronics module into theprotective fluid-like fill material, and depositing additionalprotective fluid-like fill material into the cavity after theelectronics module is deposited.
 35. A method of fabricating a tag,comprising: providing a carrier segment having a cavity therein;depositing a protective fluid-like fill material into the cavity;depositing an electronics module into the protective fluid-like fillmaterial; heating the carrier segment such that the protectivefluid-like fill material expands to over-fill the cavity in the carriersegment; and inserting the carrier segment into a cavity in a carrier,such that over-filled portions of the protective fluid-like fillmaterial are sheared from a surface of the carrier segment, and suchthat the protective fluid-like fill material within the cavity in thecarrier segment is void-free.